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BUEHLER Special Solutions for Sample Preparation
VibroMet 2
Vibratory polishing offers a cost effective means of preparing high quality polished surfaces on a wide variety of materials. VibroMet 2 utilizes a powerful drive mechanism that produces nearly 100% horizontal vibratory motion with virtually no vertical motion on a 12" diameter surface. This motion of 7200 cycles per second produces a gentle yet very effective polishing action with superior quality results and exceptional flatness.
Brochure VibroMet 2
Vibratory polishing offers a cost effective means of preparing high quality polished surfaces on a wide variety of materials. VibroMet 2 utilizes a powerful drive mechanism that produces nearly 100% horizontal vibratory motion with virtually no vertical motion on a 12" diameter surface. This motion of 7200 cycles per second produces a gentle yet very effective polishing action with superior quality results and exceptional flatness.
Brochure VibroMet 2
MiniMet 1000 - The Miniature Preparation System!
The MiniMet 1000 is designed for a low volume laboratory preparing single specimens. This semi-automatic grinder-polisher prepares a wide variety of materials using three self contained preparation bowls and easy-to-use touch panel controls. Its space saving design employs a patented geometric action that combines the advantage of hand-lapping as well as mechanical polishing. This motion provides a random polishing action, eliminating any induced polishing artifacts.
Brochure MiniMet 1000
The MiniMet 1000 is designed for a low volume laboratory preparing single specimens. This semi-automatic grinder-polisher prepares a wide variety of materials using three self contained preparation bowls and easy-to-use touch panel controls. Its space saving design employs a patented geometric action that combines the advantage of hand-lapping as well as mechanical polishing. This motion provides a random polishing action, eliminating any induced polishing artifacts.
Brochure MiniMet 1000
MPC 2000
The MPC™ 2000 Integrated Circuit Cross-Sectioning System is designed to accurately remove a pre-specified amount of material from a microelectronic sample without the need for operator intervention. Accurate crosssectioning within +/-1μm of a target feature is possible due to high precision provided by a combination of the precision power head, the low-runout drive plate, and the lapped, stainless-steel platen. This high accuracy reduces the possibility of grinding beyond the target plane.
Brochure MPC 2000
The MPC™ 2000 Integrated Circuit Cross-Sectioning System is designed to accurately remove a pre-specified amount of material from a microelectronic sample without the need for operator intervention. Accurate crosssectioning within +/-1μm of a target feature is possible due to high precision provided by a combination of the precision power head, the low-runout drive plate, and the lapped, stainless-steel platen. This high accuracy reduces the possibility of grinding beyond the target plane.
Brochure MPC 2000